this is information on a product in full production. september 2015 docid024678 rev 2 1/10 10 BAL-CW1250D3 50 ? nominal input / conjugate match balun to cw1250/cw1260/cw1150/cw1160, with integrated harmonic filter datasheet ? production data features ? 50 ? nominal input / match st-ericsson rf ic cw1250, cw1150, cw1260, cw1160 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? dc blocking access on single rf input ? small footprint: < 1.2 mm 2 benefits ? extremely low profile (< 550 m after reflow) ? integrate matching network ? high rf performance ? rf components count and area reduction applications ? balun with integrated matching for st-ericsson rf ic cw1250, c1150, cw1260 description stmicroelectronics BAL-CW1250D3 is a balun (balanced/unbalanced device) designed to transform a single ended signal to differential signals in wlan application. this BAL-CW1250D3, with low insertion losses in the bandwidth 2400 mhz to 2500 mhz, has been customized for cw1250, cw1150, cw1260, cw1160 transceiver. the differential output embeds an integrated matching network adapted to the transceiver. the BAL-CW1250D3 has been designed using stmicroelectronics ipd (integrated passive device) technology on non-conductive glass substrate to optimize rf performance. figure 1. pinout diagram (top view) lead-free flip-chip package 5 bumps a b c 3 2 1 se gnd vcc diff diff www.st.com
characteristics BAL-CW1250D3 2/10 docid024678 rev 2 1 characteristics table 1. absolute maximum ratings (limiting values) symbol parameter value unit min typ max p in average power rf in 24 dbm v esd esd ratings mil std883c (hbm: c = 100 pf, r = 1.5 k , air discharge) 2000 v esd ratings charged device model (jesd22-c101-d) 500 esd ratings machine model (mm: c = 200 pf, r = 25 , l = 500 nh) 200 t op operating temperature -30 to +85 c table 2. impedances (t amb = 25 c) symbol parameter value unit min typ max z out nominal differential output impedance matched z in nominal input impedance 50 table 3. rf performance (t amb = 25 c) symbol parameter value unit min typ max f frequency range (bandwidth) 2400 2500 mhz il insertion loss in bandwidth 0.97 db rl se single ended return loss in bandwidth -21 db rl diff differential return loss in bandwidth -24 db imb phase imbalance -10 10 aimb amplitude imbalance -1 0.1 1 db att 2f0 2nd harmonic attenuation -19 db
docid024678 rev 2 3/10 BAL-CW1250D3 characteristics 1.1 measurements figure 2. insertion loss figure 3. single indeed return loss s21 (db) f (ghz) -0.90 -0.92 -0.94 -0.96 -0.98 -1.0 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 f (ghz) -30 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 s11 (db) -20 -22 -24 -26 -28 figure 4. differential return loss figure 5. amplitude imbalance f (ghz) -34 -40 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 s22 (db) -24 -26 -28 -30 -36 -32 -38 f (ghz) -0.32 -0.29 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 absolute aimb (db) -0.37 -0.36 -0.35 -0.34 -0.31 -0.33 -0.30 figure 6. phase imbalance figure 7. second harmonic attenuation f (ghz) 2.52 2.46 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48 absolute phimb (deg) 2.62 2.60 2.58 2.56 2.50 2.54 2.48 s21 (db) f (ghz) -18.5 -19.0 -19.5 -20.0 -20.5 -21.0 2.40 2.44 2.47 2.49 2.50 2.41 2.42 2.43 2.45 2.46 2.48
package information BAL-CW1250D3 4/10 docid024678 rev 2 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. 2.1 flip-chip package information figure 8. flip-chip package outline table 4. flip-chip package mechanical data parameter description min. typ. max. unit a bump height + substrate thickness 0.570 0.630 0.690 mm a1 bump height 0.155 0.205 0.255 mm a2 substrate thickness 0.400 mm b bump diameter 0.215 0.255 0.295 mm d y dimension of the die 1.150 1.200 1.250 mm d1 y pitch 0.760 mm e x dimension of the die 0.940 0.990 1.040 mm e1 x pitch 0.400 mm fd distance from bump to edge of die on y axis 0.105 mm ccc 0.05 mm $0.025mm $ $ % r w w r p y l h z v l g h y l h z i ' ' ( 7 r s y l h z ' $ f f f ' & & ( 6 ( ' , ) ) 3 ' , ) ) 1 ? e 9 & & * 1 '
docid024678 rev 2 5/10 BAL-CW1250D3 package information figure 9. footprint p p p p p p $ % & figure 10. footprint - 3 mils stencil -non solder mask defined figure 11. footprint - 3 mils stencil - solder mask defined & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g figure 12. footprint - 5 mils stencil -non solder mask defined figure 13. footprint - 5 mils stencil - solder mask defined
g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g
g h s h q g l q j r q s d v w h l w f d q j r g r z q w r ? p & r s s h u s d g g l d p h w h u ? p u h f r p p h q g h g ? p p l q l p x p ? p p d [ l p x p 6 r o g h u p d v n r s h q l q j ? p u h f r p p h q g h g ? p p l q l p x p 6 r o g h u v w h q f l o r s h q l q j ? p u h f r p p h q g h g
package information BAL-CW1250D3 6/10 docid024678 rev 2 figure 14. recommended land pattern (used for balun characterization) figure 15. marking
docid024678 rev 2 7/10 BAL-CW1250D3 package information figure 16. flip-chip tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.50 0.71 0.05 1.09 0.05 0.22 1.30 0.05 st st st xxz xxz xxz yww yww yww
application information BAL-CW1250D3 8/10 docid024678 rev 2 3 application information figure 17. application schematic note: more information is available in the application notes: an2348 flip-chip package description and recommendations for use pa 2.4ghz pa 5ghz lna 2.4ghz lna 5ghz z f BAL-CW1250D3 bpf 2.4ghz bpf50-01d3 2.4g/5g rf transceiver bluetooth rx/tx 5ghz fem 2.4ghz fem dip2450-01d3
docid024678 rev 2 9/10 BAL-CW1250D3 ordering information 4 ordering information 5 revision history table 5. ordering information part number marking package weight base qty delivery mode BAL-CW1250D3 sg flip-chip 1.46 mg 5000 tape and reel(7?) table 6. document revision history date revision changes 23-may-2013 1 initial release. 23-sep-2015 2 updated figure 8 . added figure 10 , figure 11 , figure 12 , figure 13 and table 4 . reformatted to current standards.
BAL-CW1250D3 10/10 docid024678 rev 2 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2015 stmicroelectronics ? all rights reserved
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